Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 041394/0402 | |
| Pages: | 10 |
| | Recorded: | 01/18/2017 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 14/543,746 PREVIOUSLY RECORDED AT REEL: 034374 FRAME: 0055. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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14453746
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Filing Dt:
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08/07/2014
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Publication #:
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Pub Dt:
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02/11/2016
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Title:
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A Transition Between a Plastic Waveguide and a Semiconductor Chip, Where the Semiconductor Chip is Embedded and Encapsulated Within a Mold Compound
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Assignee
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ONE MICROSOFT WAY |
REDMOND, WASHINGTON 98052 |
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Correspondence name and address
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WOLFE-SBMC
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116 W. PACIFIC AVE
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SUITE 300
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SPOKANE, WA 99201
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