Patent Assignment Details
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| Reel/Frame: | 041423/0189 | |
| Pages: | 3 |
| | Recorded: | 03/01/2017 | | |
| Attorney Dkt #: | 2017-0260A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15507876
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Filing Dt:
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03/01/2017
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Publication #:
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Pub Dt:
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08/09/2018
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Title:
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SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
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Assignee
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| 7-1, SEIRAN 2-CHOME, OTSU-SHI, |
| SHIGA, JAPAN 5208639 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET NW
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SUITE 400 EAST
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WASHINGTON, DC 20005
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