Patent Assignment Details
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| Reel/Frame: | 041515/0686 | |
| Pages: | 3 |
| | Recorded: | 01/26/2017 | | |
| Attorney Dkt #: | HOK-0643 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2019
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Application #:
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15329573
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Filing Dt:
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01/26/2017
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Publication #:
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Pub Dt:
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07/26/2018
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Title:
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LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
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Assignee
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| 58, IJIRI, ISEDA-CHO |
| UJI-SHI, KYOTO, JAPAN 611-0043 |
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Correspondence name and address
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LEE CHENG
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1133 13TH STREET N.W. STE C2
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WASHINGTON, DC 20005
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05/02/2024 03:48 PM
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