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Reel/Frame:041553/0084   Pages: 9
Recorded: 03/13/2017
Attorney Dkt #:2557-002570-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/05/2019
Application #:
15455879
Filing Dt:
03/10/2017
Publication #:
Pub Dt:
03/15/2018
Title:
ALUMINUM COMPOUND, METHOD OF FORMING THIN FILM BY USING THE SAME, AND METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
Assignors
1
Exec Dt:
01/11/2017
2
Exec Dt:
01/11/2017
3
Exec Dt:
01/11/2017
Assignee
1
129 SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondence name and address
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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