Patent Assignment Details
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| Reel/Frame: | 041596/0961 | |
| Pages: | 5 |
| | Recorded: | 03/16/2017 | | |
| Attorney Dkt #: | 101716.000118 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14920104
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Filing Dt:
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10/22/2015
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Publication #:
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Pub Dt:
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02/11/2016
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Title:
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ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER BUMP
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Assignee
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| 11-1 HANEDA ASAHI-CHO |
| OHTA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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BAKER & HOSTETLER LLP
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2929 ARCH STREET
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CIRA CENTRE, 12TH FLOOR
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PHILADELPHIA, PA 19104-2891
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