Patent Assignment Details
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| Reel/Frame: | 041628/0367 | |
| Pages: | 3 |
| | Recorded: | 03/20/2017 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14759227
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Filing Dt:
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07/05/2015
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Publication #:
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Pub Dt:
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08/25/2016
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Title:
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METHOD FOR PROCESSING AN ELECTROPLATED COPPER FILM IN COPPER INTERCONNECT PROCESS
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Assignee
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| 497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG |
| SHANGHAI, CHINA 201210 |
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Correspondence name and address
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SHANGHAI IC R&D CENTER CO., LTD
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497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG
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SHANGHAI, 201210 CHINA
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