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Reel/Frame:041788/0390   Pages: 8
Recorded: 03/29/2017
Attorney Dkt #:050083-0526
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/17/2019
Application #:
15515508
Filing Dt:
03/29/2017
Publication #:
Pub Dt:
08/03/2017
Title:
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
01/16/2017
2
Exec Dt:
01/16/2017
3
Exec Dt:
01/16/2017
4
Exec Dt:
01/16/2017
5
Exec Dt:
01/16/2017
6
Exec Dt:
01/18/2017
Assignees
1
158-1 OAZA SAYAMAGAHARA
IRUMA-SHI
SAITAMA, JAPAN 358-0032
2
16-3, GINZA 7-CHOME
CHUO-KU
TOKYO, JAPAN 104-0061
Correspondence name and address
TOMOKI TANIDA
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL ST. NW
WASHINGTON, DC 20001

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