Patent Assignment Details
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| Reel/Frame: | 041987/0067 | |
| Pages: | 4 |
| | Recorded: | 04/12/2017 | | |
| Attorney Dkt #: | MIY-0497 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/04/2018
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Application #:
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15518723
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Filing Dt:
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04/12/2017
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Publication #:
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Pub Dt:
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08/17/2017
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Title:
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INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
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Assignee
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| 4-4, NISHITEMMA 2-CHOME, KITA-KU |
| OSAKA-CITY, OSAKA, JAPAN 530-8565 |
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Correspondence name and address
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LEE CHENG
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1133 13TH STREET N.W. STE C2
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WASHINGTON, DC 20005
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