Patent Assignment Details
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| Reel/Frame: | 042048/0536 | |
| Pages: | 3 |
| | Recorded: | 04/18/2017 | | |
| Attorney Dkt #: | US20171001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15490809
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Filing Dt:
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04/18/2017
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Publication #:
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Pub Dt:
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08/16/2018
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Title:
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Dual-Chip Package Structure Mounted on a Printed Circuit Board Having a Grounding Heat-Dissipating Pad
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Assignee
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| 2F., NO.17, GONGYE E. 2ND RD., EAST DIST., |
| HSINCHU CITY, TAIWAN 300 |
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Correspondence name and address
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LANWAY IPR SERVICES
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P.O. BOX 230970
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CENTREVILLE, VA 20120
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05/21/2024 10:41 PM
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