Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042304/0064 | |
| Pages: | 6 |
| | Recorded: | 04/21/2017 | | |
| Conveyance: | CHANGE OF ADDRESS |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/26/2012
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Application #:
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12312928
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Filing Dt:
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06/01/2009
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Publication #:
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Pub Dt:
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02/04/2010
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Title:
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PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13048397
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Filing Dt:
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03/15/2011
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Publication #:
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Pub Dt:
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10/27/2011
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Title:
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METHOD FOR FORMING AN ADHESIVE LAYER AND ADHESIVE COMPOSITION
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Patent #:
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Issue Dt:
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01/14/2014
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Application #:
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13091682
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Filing Dt:
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04/21/2011
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Publication #:
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Pub Dt:
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10/27/2011
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 32-42 HIGASHI SHINAGAWA 3 CHO-ME, SHINAGAWA-KU, |
| TOKYO, JAPAN 140-8860 |
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Correspondence name and address
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CPA GLOBAL LTD
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LIBERATION HOUSE
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CASTLE STREET
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ST HELIER, JE1 1BL JERSEY
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