Patent Assignment Details
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Reel/Frame: | 042344/0425 | |
| Pages: | 8 |
| | Recorded: | 05/11/2017 | | |
Attorney Dkt #: | 050083-0488 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/27/2018
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Application #:
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15107421
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Filing Dt:
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06/22/2016
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Publication #:
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Pub Dt:
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07/13/2017
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignees
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158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
SAITAMA, JAPAN 358-0032 |
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16-3, GINZA 7-CHOME, CHUO-KU |
TOKYO, JAPAN 104-0061 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET
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WASHINGTON, DC 20001
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04/20/2024 01:37 AM
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