Patent Assignment Details
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Reel/Frame: | 042364/0474 | |
| Pages: | 3 |
| | Recorded: | 05/12/2017 | | |
Attorney Dkt #: | 106915-0206 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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Application #:
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15594396
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Filing Dt:
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05/12/2017
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Publication #:
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Pub Dt:
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08/31/2017
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Title:
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WIRING CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WIRING CIRCUIT BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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5-1, TAITO 1-CHOME, TAITO-KU |
TOKYO, JAPAN 1100016 |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K STREET N.W.
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SUITE 600
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WASHINGTON, DC 20007-5109
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05/14/2024 10:46 PM
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