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Reel/Frame:042392/0416   Pages: 3
Recorded: 05/16/2017
Attorney Dkt #:XERP192US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/20/2018
Application #:
15596292
Filing Dt:
05/16/2017
Publication #:
Pub Dt:
11/22/2018
Title:
METHOD OF FORMING TWO-DIMENSIONAL AND THREE-DIMENSIONAL SEMICONDUCTOR CHIP ARRAYS
Assignors
1
Exec Dt:
05/15/2017
2
Exec Dt:
05/15/2017
3
Exec Dt:
05/15/2017
4
Exec Dt:
05/15/2017
Assignee
1
45 GLOVER AVENUE
NORWALK, CONNECTICUT 06856
Correspondence name and address
SIMPSON & SIMPSON, PLLC
5555 MAIN STREET
WILLIAMSVILLE, NY 14221-5406

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