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Reel/Frame:042415/0985   Pages: 5
Recorded: 05/17/2017
Attorney Dkt #:P170384US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/20/2019
Application #:
15527622
Filing Dt:
05/17/2017
Publication #:
Pub Dt:
11/09/2017
Title:
ETCHING METHOD FOR SIC SUBSTRATE AND HOLDING CONTAINER
Assignors
1
Exec Dt:
04/07/2017
2
Exec Dt:
04/07/2017
3
Exec Dt:
04/07/2017
4
Exec Dt:
04/07/2017
5
Exec Dt:
04/07/2017
6
Exec Dt:
04/20/2017
7
Exec Dt:
04/20/2017
8
Exec Dt:
04/26/2017
Assignees
1
7-12, TAKESHIMA 5-CHOME, NISHIYODOGAWA-KU
OSAKA-SHI, OSAKA, JAPAN 555-0011
2
1-155, UEGAHARA-ICHIBAN-CHO
NISHINOMIYA-SHI, HYOGO, JAPAN 662-8501
Correspondence name and address
WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
1250 CONNECTICUT AVENUE, NW
SUITE 700
WASHINGTON, DC 20036

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