Patent Assignment Details
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| Reel/Frame: | 042428/0725 | |
| Pages: | 3 |
| | Recorded: | 05/18/2017 | | |
| Attorney Dkt #: | HITACHI10-111401540US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/24/2018
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Application #:
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15598674
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Filing Dt:
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05/18/2017
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Publication #:
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Pub Dt:
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09/07/2017
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Title:
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LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GLASS FRIT, LOW-TEMPERATURE SEALING GLASS PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE GLASS PASTE CONTAINING GLASS COMPOSITION, AND GLASS-SEALED COMPONENT AND ELECTRIC/ELECTRONIC COMPONENT PREPARED USING THE SAME
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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C. FREDERICK KOENIG III
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VOLPE AND KOENIG, P.C.
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30 SOUTH 17TH STREET, 18TH FLOOR
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PHILADELPHIA, PA 19103
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