Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042453/0172 | |
| Pages: | 25 |
| | Recorded: | 05/12/2017 | | |
| Attorney Dkt #: | T&A-GEN/Z-1704(USMA)-B1 |
| Conveyance: | MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09003516
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Filing Dt:
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01/06/1998
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Title:
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A LEAD BONDING MACHINE FOR BONDING LEADS OF A CHIP DISPOSED OVER A CARRIER TAPE TO AN ELECTRODE PAD FORMED ON THE CHIP
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10082311
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Filing Dt:
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02/26/2002
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Publication #:
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Pub Dt:
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11/14/2002
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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05/04/2004
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Application #:
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10279827
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Filing Dt:
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10/25/2002
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Publication #:
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Pub Dt:
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05/08/2003
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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10318246
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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05/08/2003
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Title:
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METHOD OF BONDING INNER LEADS TO CHIP PADS
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Assignor
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Newly Merged Entity Data
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Newly Merged Entity's New Name
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| 14-1, KYOBASHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MATTINGLY & MALUR, PC
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1800 DIAGONAL ROAD
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SUITE 210
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ALEXANDRIA, VA 22314
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