Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042458/0109 | |
| Pages: | 14 |
| | Recorded: | 05/12/2017 | | |
| Attorney Dkt #: | T&A-GEN/Z-1704(USMA)-C1 |
| Conveyance: | MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09961368
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Filing Dt:
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09/25/2001
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Publication #:
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Pub Dt:
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04/11/2002
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Title:
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METHOD OF DICING TO FORM ENCAPULATED SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10653894
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Filing Dt:
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09/04/2003
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A FLEXIBLE WIRING SUBSTRATE
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Assignor
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Newly Merged Entity Data
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Newly Merged Entity's New Name
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| 39, 1007, IZUMISAWA, CHITOSE-SHI |
| HOKKAI-DO, JAPAN |
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Correspondence name and address
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MATTINGLY & MALUR, PC
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1800 DIAGONAL ROAD
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SUITE 210
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ALEXANDRIA, VA 22314
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