Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042651/0147 | |
| Pages: | 3 |
| | Recorded: | 06/08/2017 | | |
| Attorney Dkt #: | 0941-3558PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/24/2019
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Application #:
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15609523
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Filing Dt:
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05/31/2017
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Publication #:
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Pub Dt:
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12/06/2018
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Title:
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METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE WITH TWINNED COPPER LAYER
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Assignee
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| NO.8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH STEWART KOLASCH & BIRCH, LLP
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P.O. BOX 747
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FALLS CHURCH, VA 22042-0747
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05/17/2024 08:49 PM
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