Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042796/0010 | |
| Pages: | 8 |
| | Recorded: | 06/23/2017 | | |
| Attorney Dkt #: | 7466-1704106 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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15539323
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Filing Dt:
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06/23/2017
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Publication #:
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Pub Dt:
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01/18/2018
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Title:
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Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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THE WEBB LAW FIRM, P.C.
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ONE GATEWAY CENTER
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420 FT. DUQUESNE BLVD, SUITE 1200
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PITTSBURGH, PA 15222
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