Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 042877/0906 | |
| Pages: | 6 |
| | Recorded: | 06/16/2017 | | |
| Attorney Dkt #: | 089994-0017 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2020
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Application #:
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15537390
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Filing Dt:
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06/16/2017
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Publication #:
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Pub Dt:
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12/21/2017
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignees
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| 16-3, GINZA 7-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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| 158-1 OAZA SAYAMAGAHARA |
| IRUMA-SHI, SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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