Patent Assignment Details
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| Reel/Frame: | 043077/0235 | |
| Pages: | 3 |
| | Recorded: | 07/24/2017 | | |
| Attorney Dkt #: | 2017-0769A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/17/2020
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Application #:
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15525811
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Filing Dt:
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05/10/2017
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Publication #:
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Pub Dt:
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11/15/2018
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Title:
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Au-Sn-Ag-BASED SOLDER ALLOY AND SOLDER MATERIAL, ELECTRONIC COMPONENT SEALED WITH THE SAME Au-Sn-Ag BASED SOLDER ALLOY OR SOLDER MATERIAL, AND ELECTRONIC COMPONENT MOUNTING DEVICE
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Assignee
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8716 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET, NW
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SUITE 400 EAST
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WASHINGTON, DC 20005
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