Patent Assignment Details
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| Reel/Frame: | 043133/0116 | |
| Pages: | 3 |
| | Recorded: | 07/28/2017 | | |
| Attorney Dkt #: | 3531.129157 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/30/2018
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Application #:
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15663189
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Filing Dt:
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07/28/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Title:
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SiC WAFER PRODUCING METHOD
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Assignee
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU, |
| TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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GREER, BURNS & CRAIN, LTD
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300 S. WACKER DR.
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SUITE 2500
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CHICAGO, IL 60606
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