Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 043158/0374 | |
| Pages: | 4 |
| | Recorded: | 08/01/2017 | | |
| Attorney Dkt #: | NP-14390-1-US(TLC001701DV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/2018
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Application #:
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15340108
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Filing Dt:
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11/01/2016
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Publication #:
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Pub Dt:
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02/16/2017
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Title:
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METAL CAPPING PROCESS AND PROCESSING PLATFORM THEREOF
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Assignee
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| NO.8, LI-HSIN RD.6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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SERVILLA WHITNEY LLC
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33 WOOD AVENUE SOUTH, SUITE 830
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ISELIN, NJ 08830
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