Patent Assignment Details
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| Reel/Frame: | 043232/0504 | |
| Pages: | 15 |
| | Recorded: | 08/08/2017 | | |
| Attorney Dkt #: | 728943 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/23/2020
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Application #:
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15615375
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Filing Dt:
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06/06/2017
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Publication #:
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Pub Dt:
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01/04/2018
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Title:
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SUBSTRATE PROCESSING APPARATUS
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN 144-8510 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD
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TWO PRUDENTIAL PLAZA, SUITE 4900
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180 NORTH STETSON AVENUE
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CHICAGO, IL 60601-6731
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