Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 043632/0767 | |
| Pages: | 8 |
| | Recorded: | 09/19/2017 | | |
| Attorney Dkt #: | TMR-P0004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2021
|
Application #:
|
15709424
|
Filing Dt:
|
09/19/2017
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2018
| | | | |
|
Title:
|
LEAD-FREE SOLDER ALLOY, SOLDER JOINT, SOLDER PASTE COMPOSITION, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC DEVICE
|
|
|
Assignee
|
|
|
|
|
| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
|
|
Correspondence name and address
|
| |
MORI & WARD, LLP
|
| |
225 REINEKERS LANE
|
| |
SUITE 690
|
| |
ALEXANDRIA, VA 22314
|
Search Results as of:
05/02/2024 12:08 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
