Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 043686/0914 | |
| Pages: | 6 |
| | Recorded: | 09/26/2017 | | |
| Attorney Dkt #: | 72038-US-975 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15708150
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Filing Dt:
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09/19/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Title:
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SOLDER MATERIAL AND ELECTRONIC COMPONENT
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Assignee
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| 1-47-1, SASAZUKA, SHIBUYA-KU, |
| TOKYO, JAPAN 151-8569 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 100 TAIWAN
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