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Reel/Frame:043717/0157   Pages: 3
Recorded: 09/27/2017
Attorney Dkt #:FIP-43021
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/21/2019
Application #:
15562255
Filing Dt:
09/27/2017
Publication #:
Pub Dt:
03/22/2018
Title:
RESIN COMPOSITION, CONDUCTIVE RESIN COMPOSITION, ADHESIVE, CONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
07/26/2017
2
Exec Dt:
07/26/2017
Assignee
1
3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI
NIIGATA, JAPAN 950-3131
Correspondence name and address
RANKIN, HILL & CLARK LLP
23755 LORAIN ROAD, SUITE 200
NORTH OLMSTED, OH 44070

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