Patent Assignment Details
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| Reel/Frame: | 043911/0211 | |
| Pages: | 5 |
| | Recorded: | 10/20/2017 | | |
| Attorney Dkt #: | 1420149.586US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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15566817
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Filing Dt:
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10/16/2017
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Publication #:
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Pub Dt:
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04/19/2018
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Title:
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BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING HEAT SINK
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Assignee
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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