Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 043943/0235 | |
| Pages: | 6 |
| | Recorded: | 10/25/2017 | | |
| Attorney Dkt #: | 17007US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15792417
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Filing Dt:
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10/24/2017
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Publication #:
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Pub Dt:
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04/25/2019
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Title:
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MICROCAPPED PACKAGE HAVING POLYMER ELECTRICALLY INSULATING LAYER DISPOSED BETWEEN AN ELECTRICAL CONTACT PAD AND AN UPPER SURFACE OF A LID
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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BROADCOM LIMITED
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11951 FREEDOM DRIVE, 13TH FLOOR
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ONE FREEDOM SQUARE
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RESTON, VA 20191
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