Patent Assignment Details
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| Reel/Frame: | 043970/0235 | |
| Pages: | 4 |
| | Recorded: | 09/15/2017 | | |
| Attorney Dkt #: | SPO.062.0003.PC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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15558562
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Filing Dt:
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09/15/2017
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Publication #:
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Pub Dt:
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03/01/2018
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Title:
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SOLDER PROCESSING DEVICE
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Assignee
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| LAB. WING, KEIHANNA PLAZA, 1-7, HIKARIDAI, SEIKA-CHO |
| SOURAKU-GUN, KYOTO, JAPAN 619-0237 |
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Correspondence name and address
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METROLEXIS LAW GROUP, PLLC - JP
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900 17TH STREET, NW.
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SUITE 320
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WASHINGTON, DC 20006
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