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Reel/Frame:043978/0687   Pages: 3
Recorded: 10/30/2017
Attorney Dkt #:PA150.0025
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/14/2019
Application #:
15563407
Filing Dt:
09/29/2017
Publication #:
Pub Dt:
03/29/2018
Title:
Packaging Method and Semiconductor Device
Assignors
1
Exec Dt:
09/22/2017
2
Exec Dt:
09/20/2017
3
Exec Dt:
09/22/2017
Assignee
1
BUILDING 3, NO. 235 CHENGBEI RD, JIADING DISTRICT
SHANGHAI, CHINA 201800
Correspondence name and address
NOVICK, KIM & LEE, PLLC
3251 OLD LEE HIGHWAY, SUITE 404
FAIRFAX, VA 22030

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