USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Assignments on the Web > Patent Query

Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	043979/0820			Pages:	18
		Recorded:	09/25/2017
Attorney Dkt #:	UTACS2015SVE103
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE INCLUDE PATENT NUMBER 8816482 PREVIOUSLY RECORDED AT REEL: 039885 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Total properties: 47

Patent #:	7443041	Issue Dt:	10/28/2008	Application #:	10312589	Filing Dt:	05/19/2004
Publication #:	US20050257955	Pub Dt:	11/24/2005
Title:	PACKAGING OF A MICROCHIP DEVICE

Patent #:	7023076	Issue Dt:	04/04/2006	Application #:	10347356	Filing Dt:	01/21/2003
Publication #:	US20040012079	Pub Dt:	01/22/2004
Title:	MULTIPLE CHIP SEMICONDUCTOR PACKAGES

Patent #:	8288862	Issue Dt:	10/16/2012	Application #:	10361814	Filing Dt:	02/11/2003
Publication #:	US20030197284	Pub Dt:	10/23/2003
Title:	MULTIPLE DIE STACK PACKAGE

Patent #:	6921974	Issue Dt:	07/26/2005	Application #:	10400803	Filing Dt:	03/28/2003
Publication #:	US20040188864	Pub Dt:	09/30/2004
Title:	PACKAGED DEVICE WITH THERMAL ENHANCEMENT AND METHOD OF PACKAGING

Patent #:	7361995	Issue Dt:	04/22/2008	Application #:	10543301	Filing Dt:	07/26/2005
Publication #:	US20060087033	Pub Dt:	04/27/2006
Title:	MOLDED HIGH DENSITY ELECTRONIC PACKAGING STRUCTURE FOR HIGH PERFORMANCE APPLICATIONS

Patent #:	8129222	Issue Dt:	03/06/2012	Application #:	10721382	Filing Dt:	11/26/2003
Publication #:	US20040104457	Pub Dt:	06/03/2004
Title:	HIGH DENSITY CHIP SCALE LEADFRAME PACKAGE AND METHOD OF MANUFACTURING THE PACKAGE

Patent #:	7109570	Issue Dt:	09/19/2006	Application #:	10812058	Filing Dt:	03/30/2004
Publication #:	US20050051876	Pub Dt:	03/10/2005
Title:	INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME ENHANCEMENT AND METHOD OF MANUFACTURING THE SAME

Patent #:	7678610	Issue Dt:	03/16/2010	Application #:	11260091	Filing Dt:	10/28/2005
Publication #:	US20060192292	Pub Dt:	08/31/2006
Title:	SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

Patent #:	7375416	Issue Dt:	05/20/2008	Application #:	11406357	Filing Dt:	04/19/2006
Publication #:	US20070246810	Pub Dt:	10/25/2007
Title:	LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDUCTOR PACKAGE

Patent #:	8039951	Issue Dt:	10/18/2011	Application #:	11495781	Filing Dt:	07/31/2006
Publication #:	US20070164425	Pub Dt:	07/19/2007
Title:	THERMALLY ENHANCED SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Patent #:	7339278	Issue Dt:	03/04/2008	Application #:	11536635	Filing Dt:	09/28/2006
Publication #:	US20070069371	Pub Dt:	03/29/2007
Title:	CAVITY CHIP PACKAGE

Patent #:	7830006	Issue Dt:	11/09/2010	Application #:	11579326	Filing Dt:	11/10/2008
Publication #:	US20090072391	Pub Dt:	03/19/2009
Title:	STRUCTURALLY-ENHANCED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE

Patent #:	7816775	Issue Dt:	10/19/2010	Application #:	11662431	Filing Dt:	08/22/2007
Publication #:	US20080150103	Pub Dt:	06/26/2008
Title:	MULTI-DIE IC PACKAGE AND MANUFACTURING METHOD

Patent #:	9281218	Issue Dt:	03/08/2016	Application #:	11846658	Filing Dt:	08/29/2007
Publication #:	US20080061414	Pub Dt:	03/13/2008
Title:	Method of Producing a Semiconductor Package

Patent #:	7723833	Issue Dt:	05/25/2010	Application #:	11846665	Filing Dt:	08/29/2007
Publication #:	US20080054435	Pub Dt:	03/06/2008
Title:	STACKED DIE PACKAGES

Patent #:	7642638	Issue Dt:	01/05/2010	Application #:	11959519	Filing Dt:	12/19/2007
Publication #:	US20080150106	Pub Dt:	06/26/2008
Title:	INVERTED LEAD FRAME IN SUBSTRATE

Patent #:	8030768	Issue Dt:	10/04/2011	Application #:	12108563	Filing Dt:	04/24/2008
Publication #:	US20080284015	Pub Dt:	11/20/2008
Title:	SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ALIGNED WITH OPEN VIAS

Patent #:	7824960	Issue Dt:	11/02/2010	Application #:	12124830	Filing Dt:	05/21/2008
Publication #:	US20080293186	Pub Dt:	11/27/2008
Title:	METHOD OF ASSEMBLING A SILICON STACK SEMICONDUCTOR PACKAGE

Patent #:	7883938	Issue Dt:	02/08/2011	Application #:	12124880	Filing Dt:	05/21/2008
Publication #:	US20090004777	Pub Dt:	01/01/2009
Title:	STACKED DIE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLY

Patent #:	8030761	Issue Dt:	10/04/2011	Application #:	12125924	Filing Dt:	05/23/2008
Publication #:	US20080290505	Pub Dt:	11/27/2008
Title:	MOLD DESIGN AND SEMICONDUCTOR PACKAGE

Patent #:	8586465	Issue Dt:	11/19/2013	Application #:	12133376	Filing Dt:	06/05/2008
Publication #:	US20080303163	Pub Dt:	12/11/2008
Title:	THROUGH SILICON VIA DIES AND PACKAGES

Patent #:	8143719	Issue Dt:	03/27/2012	Application #:	12133377	Filing Dt:	06/05/2008
Publication #:	US20080303031	Pub Dt:	12/11/2008
Title:	VENTED DIE AND PACKAGE

Patent #:	8816482	Issue Dt:	08/26/2014	Application #:	12330681	Filing Dt:	12/09/2008
Publication #:	US20090146276	Pub Dt:	06/11/2009
Title:	FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE

Patent #:	7948095	Issue Dt:	05/24/2011	Application #:	12369429	Filing Dt:	02/11/2009
Publication #:	US20090200662	Pub Dt:	08/13/2009
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

Patent #:	8247272	Issue Dt:	08/21/2012	Application #:	12489409	Filing Dt:	06/22/2009
Publication #:	US20100025849	Pub Dt:	02/04/2010
Title:	COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND ENHANCED WIRE BONDING PROCESS

Patent #:	8384203	Issue Dt:	02/26/2013	Application #:	12505552	Filing Dt:	07/20/2009
Publication #:	US20100013081	Pub Dt:	01/21/2010
Title:	PACKAGING STRUCTURAL MEMBER

Patent #:	8115292	Issue Dt:	02/14/2012	Application #:	12604613	Filing Dt:	10/23/2009
Publication #:	US20100109142	Pub Dt:	05/06/2010
Title:	INTERPOSER FOR SEMICONDUCTOR PACKAGE

Patent #:	8647924	Issue Dt:	02/11/2014	Application #:	12758820	Filing Dt:	04/13/2010
Publication #:	US20100261313	Pub Dt:	10/14/2010
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	8544755	Issue Dt:	10/01/2013	Application #:	13171421	Filing Dt:	06/28/2011
Publication #:	US20110315779	Pub Dt:	12/29/2011
Title:	SUBSCRIBER IDENTITY MODULE (SIM) CARD

Patent #:	8716873	Issue Dt:	05/06/2014	Application #:	13174923	Filing Dt:	07/01/2011
Publication #:	US20120001306	Pub Dt:	01/05/2012
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	8399985	Issue Dt:	03/19/2013	Application #:	13244630	Filing Dt:	09/25/2011
Publication #:	US20120018869	Pub Dt:	01/26/2012
Title:	MOLD DESIGN AND SEMICONDUCTOR PACKAGE

Patent #:	8829666	Issue Dt:	09/09/2014	Application #:	13295097	Filing Dt:	11/14/2011
Publication #:	US20120119378	Pub Dt:	05/17/2012
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	8772921	Issue Dt:	07/08/2014	Application #:	13347683	Filing Dt:	01/10/2012
Publication #:	US20120104628	Pub Dt:	05/03/2012
Title:	INTERPOSER FOR SEMICONDUCTOR PACKAGE

Patent #:	8703534	Issue Dt:	04/22/2014	Application #:	13360796	Filing Dt:	01/29/2012
Publication #:	US20120193812	Pub Dt:	08/02/2012
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	8860079	Issue Dt:	10/14/2014	Application #:	13467050	Filing Dt:	05/09/2012
Publication #:	US20120220082	Pub Dt:	08/30/2012
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9023690	Issue Dt:	05/05/2015	Application #:	13681302	Filing Dt:	11/19/2012
Publication #:	US20140138808	Pub Dt:	05/22/2014
Title:	LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

Patent #:	9142487	Issue Dt:	09/22/2015	Application #:	13737923	Filing Dt:	01/09/2013
Publication #:	US20130119560	Pub Dt:	05/16/2013
Title:	PACKAGING STRUCTURAL MEMBER

Patent #:	9087777	Issue Dt:	07/21/2015	Application #:	13802769	Filing Dt:	03/14/2013
Publication #:	US20140264789	Pub Dt:	09/18/2014
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	8916422	Issue Dt:	12/23/2014	Application #:	13831964	Filing Dt:	03/15/2013
Publication #:	US20140264835	Pub Dt:	09/18/2014
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9613877	Issue Dt:	04/04/2017	Application #:	14051417	Filing Dt:	10/10/2013
Publication #:	US20150102478	Pub Dt:	04/16/2015
Title:	SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

Patent #:	8741762	Issue Dt:	06/03/2014	Application #:	14058310	Filing Dt:	10/21/2013
Publication #:	US20140045301	Pub Dt:	02/13/2014
Title:	THROUGH SILICON VIA DIES AND PACKAGES

Patent #:	9165878	Issue Dt:	10/20/2015	Application #:	14094763	Filing Dt:	12/02/2013
Publication #:	US20140264792	Pub Dt:	09/18/2014
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9117808	Issue Dt:	08/25/2015	Application #:	14257013	Filing Dt:	04/21/2014
Publication #:	US20140225242	Pub Dt:	08/14/2014
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9136142	Issue Dt:	09/15/2015	Application #:	14257017	Filing Dt:	04/21/2014
Publication #:	US20140227832	Pub Dt:	08/14/2014
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9312240	Issue Dt:	04/12/2016	Application #:	14521481	Filing Dt:	10/23/2014
Publication #:	US20150061101	Pub Dt:	03/05/2015
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9391026	Issue Dt:	07/12/2016	Application #:	14561157	Filing Dt:	12/04/2014
Publication #:	US20150084197	Pub Dt:	03/26/2015
Title:	SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Patent #:	9472532	Issue Dt:	10/18/2016	Application #:	14678840	Filing Dt:	04/03/2015
Publication #:	US20150214187	Pub Dt:	07/30/2015
Title:	LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

Assignor

UNITED TEST AND ASSEMBLY CENTER LIMITED

Exec Dt:

05/08/2015

Assignee

UTAC HEADQUARTERS PTE. LTD.

22 ANG MO KIO INDUSTRIAL PARK 2

SINGAPORE, SINGAPORE 569506

Correspondence name and address
	HORIZON IP PTE. LTD.
	7500A BEACH ROAD, #04-306/308
	THE PLAZA
	SINGAPORE, SINGAPORE

Search Results as of: 05/22/2024 07:59 AM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6