Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 044176/0054 | |
| Pages: | 4 |
| | Recorded: | 11/20/2017 | | |
Attorney Dkt #: | 20370-142174-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/10/2020
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Application #:
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15575440
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Filing Dt:
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11/20/2017
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Publication #:
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Pub Dt:
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06/14/2018
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Title:
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EPOXY RESIN COMPOSITION, THERMALLY-CONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT DISSIPATION MATERIAL, LAMINATE, METAL SUBSTRATE, AND PRINTED CIRCUIT BOARD
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Assignee
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9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET, SUITE 1600
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CHICAGO, IL 60603-3406
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