Patent Assignment Details
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| Reel/Frame: | 044311/0541 | |
| Pages: | 7 |
| | Recorded: | 12/06/2017 | | |
| Attorney Dkt #: | 7466-1708716 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15832905
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Filing Dt:
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12/06/2017
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Publication #:
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Pub Dt:
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06/21/2018
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Title:
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Core Material, Semiconductor Package, and Forming Method of Bump Electrode
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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THE WEBB LAW FIRM, P.C.
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ONE GATEWAY CENTER
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420 FT. DUQUESNE BLVD, SUITE 1200
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PITTSBURGH, PA 15222
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