Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044375/0972 | |
| Pages: | 6 |
| | Recorded: | 12/13/2017 | | |
| Attorney Dkt #: | SAE-1702-USPT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/07/2020
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Application #:
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15838409
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Filing Dt:
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12/12/2017
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Publication #:
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Pub Dt:
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06/13/2019
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Title:
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HEAT DISSIPATION SYSTEM OF ENCLOSED ELECTRONIC MODULE WITH SINGLE/MULTIPLE ACTIVE COMPONENTS
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Assignee
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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Correspondence name and address
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B.Y.I.P., LTD
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P.O. BOX 1484
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GENERAL POST OFFICE
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HONG KONG, HONG KONG
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