Patent Assignment Details
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| Reel/Frame: | 044408/0557 | |
| Pages: | 3 |
| | Recorded: | 12/15/2017 | | |
| Attorney Dkt #: | 2017-1844A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15577949
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Filing Dt:
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11/29/2017
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Publication #:
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Pub Dt:
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04/26/2018
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Title:
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ACIDIC COPPER PLATING SOLUTION, ACIDIC COPPER PLATED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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Assignee
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| 344-1, OKUMOTOCHO 1-CHO, KITA-KU, SAKAI-SHI |
| OSAKA, JAPAN 591-8007 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET, NW
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SUITE 400 EAST
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WASHINGTON, DC 20005
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