Patent Assignment Details
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| Reel/Frame: | 044658/0028 | |
| Pages: | 2 |
| | Recorded: | 01/18/2018 | | |
| Attorney Dkt #: | TORA-108US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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15567822
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Filing Dt:
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10/19/2017
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Publication #:
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Pub Dt:
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06/14/2018
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Title:
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RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT USING THE SAME, AND SEMICONDUCTOR DEVICE
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Assignee
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| 1-1, NIHONBASHI-MUROMACHI, 2-CHOME |
| CHUO-KU, TOKYO, JAPAN 103-8666 |
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Correspondence name and address
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STEPHEN D. HARPER, REG. NO. 33,243
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2200 RENAISSANCE BLVD.
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SUITE 350
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KING OF PRUSSIA, PA 19406
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