Patent Assignment Details
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| Reel/Frame: | 044699/0585 | |
| Pages: | 7 |
| | Recorded: | 01/23/2018 | | |
| Attorney Dkt #: | J-17-0206 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/25/2021
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Application #:
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15746876
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Filing Dt:
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01/23/2018
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Publication #:
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Pub Dt:
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04/09/2020
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Title:
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A CIRCUIT BODY STRUCTURE, WHERE PLANAR CONDUCTORS ON DIFFERENT LAYERS OF A MULTILAYER BOARD ARE CONNECTED BY AN INTERLAYERS CONNECTION
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Assignee
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| 10, NISSHIN-CHO 1-CHOME, FUCHU-SHI, |
| TOKYO, JAPAN 183-8551 |
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Correspondence name and address
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MR. JIRO HASHIMOTO NEC-IAC
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2100 PENNSYLVANIA AVE., NW
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SUITE 801
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WASHINGTON, DC 20037-3213
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