Patent Assignment Details
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| Reel/Frame: | 044782/0408 | |
| Pages: | 5 |
| | Recorded: | 01/31/2018 | | |
| Attorney Dkt #: | 100100.010001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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10226520
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Filing Dt:
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08/22/2002
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Title:
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METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT WITH DIELECTRIC DIFFUSION BARRIER LAYER FORMED BETWEEN INTERCONNECTS AND INTERLAYER DIELECTRIC LAYERS
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10608883
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Filing Dt:
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06/26/2003
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Title:
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INTEGRATED CIRCUIT WITH DIELECTRIC DIFFUSION BARRIER LAYER FORMED BETWEEN INTERCONNECTS AND INTERLAYER DIELECTRIC LAYERS
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Assignee
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| ONE AMD PLACE |
| P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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Correspondence name and address
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CHRISTOPHER J. RECKAMP
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311 S. WACKER DRIVE
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FAEGRE BAKER DANIELS LLP
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CHICAGO, IL 60606
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