Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044847/0327 | |
| Pages: | 11 |
| | Recorded: | 12/12/2017 | | |
| Attorney Dkt #: | 1012-1918 / 2017P50527 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/28/2020
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Application #:
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15605091
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Filing Dt:
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05/25/2017
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Publication #:
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Pub Dt:
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11/29/2018
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Title:
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Semiconductor Chip Package Having a Cooling Surface and Method of Manufacturing a Semiconductor Package
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Assignee
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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05/12/2024 08:48 AM
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