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06/26/2001
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09280103
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03/29/1999
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11/27/2001
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03/29/1999
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11/13/2001
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09281642
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03/31/1999
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04/30/2002
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09283528
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04/01/1999
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04/17/2001
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04/06/1999
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04/11/2000
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09286869
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04/06/1999
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11/20/2001
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09291781
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04/14/1999
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04/03/2001
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09292079
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04/14/1999
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02/20/2001
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09292860
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04/16/1999
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10/22/2002
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04/21/1999
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01/03/2002
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02/20/2001
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09298068
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04/22/1999
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METHOD OF FORMING A MULTI-LAYERED DUAL-POLYSILICON STRUCTURE
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05/18/2004
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05/05/1999
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06/15/2004
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05/12/1999
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12/10/2002
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09310701
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05/07/1999
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IMPROVED WEHNELT GUN FOR ELECTRON LITHOGRAPHY
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03/19/2002
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05/14/1999
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01/03/2002
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12/31/2002
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05/14/1999
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10/17/2002
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08/28/2001
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06/14/1999
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07/24/2001
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06/15/1999
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07/09/2002
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09334977
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06/17/1999
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LAYERED DIELECTRIC FILM STRUCTURE SUITABLE FOR GATE DIELECTRIC APPLICATION IN SUB-0.25 uM TECHNOLOGIES
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03/06/2001
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06/18/1999
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PROCESS FOR FABRICATING VERTICAL TRANSISTORS
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07/03/2001
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09338143
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06/22/1999
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INTEGRATED CIRCUIT HAVING A MICROMAGNETIC DEVICE INCLUDING A FERROMAGNETIC CORE AND METHOD OF MANUFACTURE THEREFOR
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11/09/2004
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06/23/1999
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04/25/2000
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06/23/1999
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METHOD OF MAKING INTEGRATED CIRCUITS WITH TUB-TIES
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04/09/2002
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06/30/1999
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METHOD FOR MAKING AN INTEGRATED CIRCUIT INCLUDING ALIGNMENT MARKS
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07/24/2001
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09345556
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06/30/1999
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METHOD FOR MAKING AN INTEGRATED CIRCUIT CAPACITOR INCLUDING TANTALUM PENTOXIDE
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07/10/2001
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09347313
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07/02/1999
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METHOD ANALYZING A SEMICONDUCTOR SURFACE USING LINE WIDTH METROLOGY WITH AUTO-CORRELATION OPERATION
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08/28/2001
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07/02/1999
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METHOD FOR MANUFACTURING A METAL-TO-METAL CAPACITOR UTILIZING ONLY ONE MASKING STEP
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07/02/2002
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07/16/1999
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VERY LOW MAGNETIC FIELD INTEGRATED CIRCUIT
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07/10/2001
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07/16/1999
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07/30/2002
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09358606
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07/21/1999
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OFF-AXIS PUPIL APERTURE AND METHOD FOR MAKING THE SAME
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08/14/2001
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09362648
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07/27/1999
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11/28/2000
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09363758
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07/29/1999
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METHOD FOR PRODUCING ORIENTED PIEZOELECTRIC FILMS
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01/16/2001
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09363781
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07/29/1999
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MONOLITHIC RESISTOR HAVING DYNAMICALLY CONTROLLABLE IMPEDANCE AND METHOD OF MANUFACTURING THE SAME
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03/20/2001
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07/30/1999
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METHOD OF MAKING INTEGRATED CIRCUIT CAPACITOR INCLUDING TAPERED PLUG
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11/28/2000
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07/30/1999
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INTEGRATED CIRCUIT CAPACITOR INCLUDING ANCHORED PLUG
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07/18/2000
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09365440
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08/02/1999
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METHOD OF SINGLE STEP DAMASCENE PROCESS FOR DEPOSITION AND GLOBAL PLANARIZATION
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05/06/2003
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08/03/1999
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METHODS AND APPARATUS FOR TESTING INTEGRATED CIRCUITS
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03/25/2003
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09369802
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08/06/1999
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FIELD EMITTING DEVICE COMPRISING FIELD-CONCENTRATING NANOCONDUCTOR ASSEMBLY AND METHOD FOR MAKING THE SAME
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02/25/2003
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08/09/1999
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LOW THRESHOLD VOLTAGE MOS TRANSISTOR AND METHOD OF MANUFACTURE
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09/11/2001
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08/06/1999
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METHOD OF MAKING A SEMICONDUCTOR WITH COPPER PASSIVATING FILM
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05/08/2001
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09370963
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08/10/1999
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USE OF A GETTER LAYER TO IMPROVE METAL TO METAL CONTACT RESISTANCE AT LOW RADIO FREQUENCY POWER
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05/22/2001
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08/16/1999
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SILICON-GERMANIUM TRANSISTOR AND ASSOCIATED METHODS
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08/14/2001
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08/17/1999
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03/27/2001
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08/18/1999
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WAFER CARRIER HEAD FOR PREVENTION OF UNINTENTIONAL SEMICONDUCTOR WAFER ROTATION
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04/27/2004
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08/19/1999
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02/13/2001
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08/23/1999
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PROCESS FOR DEUTERIUM PASSIVATION AND HOT CARRIER IMMUNITY
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05/22/2001
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08/25/1999
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GLOVE BOX FILTER SYSTEM
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08/20/2002
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09/01/1999
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PROCESS FOR FABRICATING ARTICLE HAVING SUBSTANTIAL THREE-DIMENSIONAL ORDER
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03/26/2002
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09/01/1999
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STACKED VIA KELVIN RESISTANCE TEST STRUCTURE FOR MEASURING CONTACT ANOMALIES IN MULTI-LEVEL METAL INTEGRATED CIRCUIT TECHNOLOGIES
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02/26/2002
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09/01/1999
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SEMICONDUCTOR DEVICE HAVING REGIONS OF INSULATING MATERIAL FORMED IN A SEMICONDUCTOR SUBSTRATE AND PROCESS OF MAKING THE DEVICE
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05/14/2002
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09/07/1999
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PLASMA CONFINEMENT SHIELD
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11/27/2001
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09/09/1999
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09/11/2001
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09/13/1999
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ALIGNMENT OF OPENINGS IN SEMICONDUCTOR FABRICATION
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12/11/2001
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09/14/1999
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METHOD AND APPARATUS FOR DETERMINING TEMPERATURE OF A SEMICONDUCTOR WAFER DURING FABRICATION THEREOF
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05/28/2002
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09/16/1999
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06/18/2002
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09/16/1999
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SEMICONDUCTOR DEVICE HAVING REDUCED LINE WIDTH VARIATIONS BETWEEN TIGHTLY SPACED AND ISOLATED FEATURES
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06/26/2001
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09/16/1999
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11/07/2000
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09/17/1999
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08/28/2001
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09/20/1999
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CORROSION-RESISTANT POLISHING PAD CONDITONER
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05/29/2001
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09/23/1999
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SEMICONDUCTOR WAFER FABRICATION
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05/01/2001
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09/24/1999
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METHOD FOR ENHANCING ANTIREFLECTIVE COATINGS USED IN PHOTOLIGHOGRAPHY OF ELECTRONIC DEVICES
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12/05/2000
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09/28/1999
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11/27/2001
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09/29/1999
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11/27/2001
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09/30/1999
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06/25/2002
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10/01/1999
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07/22/2003
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10/08/1999
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02/13/2001
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10/12/1999
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09/18/2001
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10/12/1999
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08/27/2002
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10/18/1999
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05/25/2004
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Application #:
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09420157
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Filing Dt:
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10/18/1999
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Title:
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ARTICLE COMPRISING ALIGNED NANOWIRES AND PROCESS FOR FABRICATING ARTICLE
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Patent #:
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Issue Dt:
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01/28/2003
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Application #:
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09420234
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Filing Dt:
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10/19/1999
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Title:
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APPARATUS FOR MEASURING THERMOMECHANICAL PROPERTIES OF PHOTO-SENSITIVE MATERIALS
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09425552
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Filing Dt:
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10/22/1999
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Title:
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METHOD FOR FORMING INTEGRATED CIRCUIT STRUCTURE HAVING LOW DIELECTRIC CONSTANT MATERIAL AND HAVING SILICON OXYNITRIDE CAPS OVER CLOSELY SPACED APART METAL LINES
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Patent #:
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Issue Dt:
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07/03/2001
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Application #:
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09426017
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Filing Dt:
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10/25/1999
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Title:
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REFERENCE THICKNESS ENDPOINT TECHNIQUES FOR POLISHING OPERATIONS
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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09426061
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Filing Dt:
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10/22/1999
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Title:
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LOW DIELECTRIC CONSTANT SILICON OXIDE-BASED DIELECTRIC LAYER FOR INTEGRATED CIRCUIT STRUCTURES HAVING IMPROVED COMPATIBILITY WITH VIA FILLER MATERIALS, AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09426453
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Filing Dt:
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10/25/1999
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Title:
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IN-SITU NANO-INTERCONNECTED CIRCUIT DEVICES AND METHOD FOR MAKING THE SAME
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Patent #:
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Issue Dt:
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01/22/2002
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Application #:
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09426457
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Filing Dt:
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10/05/1999
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Title:
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ARTICLE COMPRISING VERTICALLY NANO-INTERCONNECTED CIRCUIT DEVICES AND METHOD FOR MAKING THE SAME
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09427306
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Filing Dt:
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10/26/1999
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Title:
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METHOD OF ELIMINATING AGGLOMERATE PARTICLES IN A POLISHING SLURRY
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09427572
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Filing Dt:
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10/26/1999
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Title:
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PROCESS FOR FORMING METAL INTERCONNECT STACK FOR INTEGRATED CIRCUIT STRUCTURE
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Patent #:
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Issue Dt:
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09/25/2001
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Application #:
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09430147
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Filing Dt:
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10/29/1999
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Title:
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METHOD FOR MAKING INTEGRATED CIRCUITS HAVING FEATURES WITH REDUCED CRITICAL DIMENSIONS
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Patent #:
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Issue Dt:
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10/24/2000
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Application #:
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09430635
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Filing Dt:
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10/29/1999
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Title:
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MIGRATION FROM CONTROL WAFER TO PRODUCT WAFER PARTICLE CHECKS
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09434424
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Filing Dt:
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11/04/1999
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Title:
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METHOD FOR MAKING FIELD EFFECT DEVICES AND CAPACITORS WITH THIN FILM DIELECTRICS AND RESULTING DEVICES
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09437930
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Filing Dt:
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11/10/1999
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Title:
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TESTING INSULATION BETWEEN CONDUCTORS
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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09438642
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Filing Dt:
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11/12/1999
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Title:
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PROCESS FOR FORMING LOW K SILICON OXIDE DIELECTRIC MATERIAL WHILE SUPPRESSING PRESSURE SPIKING AND INHIBITING INCREASE IN DIELECTRIC CONSTANT
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09439048
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Filing Dt:
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11/12/1999
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Title:
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METHOD AND SYSTEM FOR DETERMINING OPERATOR STAFFING
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Patent #:
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Issue Dt:
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01/01/2002
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Application #:
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09441561
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Filing Dt:
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11/17/1999
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Title:
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METAL SILICIDE AS A BARRIER FOR MOM CAPACITORS IN CMOS TECHNOLOGIES
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Patent #:
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Issue Dt:
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12/18/2001
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Application #:
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09441676
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Filing Dt:
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11/17/1999
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Title:
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METHOD OF FABRICATING A MOM CAPACITOR HAVING A METAL SILICIDE BARRIER
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09442078
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Filing Dt:
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11/16/1999
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Title:
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METHOD AND APPARATUS FOR USING ACROSS WAFER BACK PRESSURE DIFFERENTIALS TO INFLUENCE THE PERFORMANCE OF CHEMICAL MECHANICAL POLISHING
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09442688
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Filing Dt:
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11/18/1999
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Title:
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DISTRIBUTED COMMUNICATIONS SYSTEM FOR REDUCING EQUIPMENT DOWN-TIME
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Patent #:
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Issue Dt:
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04/09/2002
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Application #:
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09444817
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Filing Dt:
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11/22/1999
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Title:
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METHOD OF POLISHING SEMICONDUCTOR STRUCTURES USING A TWO-STEP CHEMICAL MECHANICAL PLANARIZATION WITH SLURRY PARTICLES HAVING DIFFERENT PARTICLE BULK DENSITIES
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09451053
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Filing Dt:
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11/30/1999
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Title:
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SURFACE TREATMENT ANNEAL OF HYDROGENATED SILICON-OXY-CARBIDE DIELECTRIC LAYER
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09454257
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Filing Dt:
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12/02/1999
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Title:
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SLURRY FILLING A RECESS FORMED DURING SEMICONDUCTOR FABRICATION
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09454909
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Filing Dt:
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12/03/1999
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Title:
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METHODS FOR FABRICATING A MULTILEVEL INTERCONNECTION FOR AN INTEGRATED CIRCUIT DEVICE UTILIZING A SELECTIVE OVERLAYER
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09456210
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Filing Dt:
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12/07/1999
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Title:
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PROCESS FOR FABRICATING INTEGRATED CIRCUIT DEVICES HAVING THIN FILM TRANSISTORS
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09456224
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Filing Dt:
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12/07/1999
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Title:
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METHOD OF FORMING AN ALIGNMENT FEATURE IN OR ON A MULTILAYERED SEMICONDUCTOR STRUCTURE
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09456807
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Filing Dt:
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12/08/1999
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Title:
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ARTICLE COMPRISING A DIELECTRIC MATERIAL OF ZR-GE-TI-O OR HF-GE-TI-O AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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03/25/2003
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Application #:
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09459708
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Filing Dt:
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12/13/1999
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Title:
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CURVILINEAR CHEMICAL MECHANICAL PLANARIZATION DEVICE AND METHOD
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09464225
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Filing Dt:
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12/15/1999
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Title:
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CORROSION SENSITIVITY STRUCTURES FOR VIAS AND CONTACT HOLES IN INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09464297
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Filing Dt:
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12/15/1999
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Title:
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PROCESS FOR ETCHING A CONTROLLABLE THICKNESS OF OXIDE ON AN INTEGRATED CIRCUIT STRUCTURE ON A SEMICONDUCTOR SUBSTRATE USING NITROGEN PLASMA AND PLASMA AND AN RF BIAS APPLIED TO THE SUBSTRATE
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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09465880
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Filing Dt:
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12/16/1999
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Title:
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METHOD AND APPARATUS FOR THICKNESS CONTROL AND REPRODUCIBILITY OF DIELECTRIC FILM DEPOSITION
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Patent #:
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Issue Dt:
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05/08/2001
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Application #:
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09467340
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Filing Dt:
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12/20/1999
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Title:
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NON-LINEAR CIRCUIT ELEMENTS ON INTEGRATED CIRCUITS
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