Patent Assignment Details
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Reel/Frame: | 044988/0196 | |
| Pages: | 4 |
| | Recorded: | 01/03/2018 | | |
Attorney Dkt #: | 18906-1006DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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15860817
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Filing Dt:
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01/03/2018
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Publication #:
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Pub Dt:
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05/03/2018
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Title:
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PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME
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Assignee
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NO.180, LANZHOU ST., HUKOU TOWNSHIP, |
HSINCHU COUNTY, TAIWAN 303 |
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Correspondence name and address
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
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8230 BOONE BLVD, SUITE 405
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VIENNA, VA 22182
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05/21/2024 08:27 PM
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