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Reel/Frame:045073/0812   Pages: 3
Recorded: 03/01/2018
Attorney Dkt #:244585.000032
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/19/2020
Application #:
15756642
Filing Dt:
03/01/2018
Publication #:
Pub Dt:
08/30/2018
Title:
MOLDING DIE DEVICE AND MOLDING METHOD
Assignor
1
Exec Dt:
02/22/2018
Assignee
1
598-1, TATSUMAE-CHO, NAKADACHIURISAGARU
KARASUMA-DORI, KAMIGYO-KU
KYOTO-SHI, KYOTO, JAPAN 602-0912
Correspondence name and address
TROUTMAN SANDERS
875 THIRD AVENUE
NEW YORK, NY 10022

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