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Reel/Frame:045115/0285   Pages: 6
Recorded: 03/06/2018
Attorney Dkt #:024576US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
15800784
Filing Dt:
11/01/2017
Publication #:
US20180144973
Pub Dt:
05/24/2018
Title:
Electromigration Improvement Using Tungsten For Selective Cobalt Deposition On Copper Surfaces
Assignors
1
YE, WEIFENG
Exec Dt:
02/28/2018
2
LU, JIANG
Exec Dt:
02/28/2018
3
CHEN, FENG F.
Exec Dt:
02/28/2018
4
WU, ZHIYUAN
Exec Dt:
03/01/2018
5
WU, KAI
Exec Dt:
02/28/2018
6
BANTHIA, VIKASH
Exec Dt:
03/02/2018
7
REN, HE
Exec Dt:
03/01/2018
8
YU, SANG HO
Exec Dt:
03/01/2018
9
CHANG, MEI
Exec Dt:
03/01/2018
10
MA, FEIYUE
Exec Dt:
02/28/2018
11
LEI, YU
Exec Dt:
02/28/2018
12
KASHEFIZADEH, KEYVAN
Exec Dt:
03/01/2018
13
MORAES, KEVIN
Exec Dt:
03/01/2018
14
MA, PAUL F.
Exec Dt:
03/01/2018
15
AI, HUA
Exec Dt:
03/01/2018
Assignee
1
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
SERVILLA WHITNEY LLC
33 WOOD AVENUE SOUTH
SUITE 830
ISELIN, NJ 08830

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