Patent Assignment Details
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| Reel/Frame: | 045251/0135 | |
| Pages: | 8 |
| | Recorded: | 03/16/2018 | | |
| Attorney Dkt #: | BPI20183548US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/23/2019
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Application #:
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15923048
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Filing Dt:
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03/16/2018
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Publication #:
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Pub Dt:
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07/19/2018
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Title:
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FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE
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Assignee
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| (SEOKWOO-DONG) 46, SAMSUNG 1-RO 5-GIL, HWASEONG-SI, GYEONGGI-DO |
| HWASEONG-SI, KOREA, REPUBLIC OF 18449 |
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Correspondence name and address
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LEX IP MEISTER, PLLC
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5180 PARKSTONE DRIVE, SUITE 175
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CHANTILLY, VA 20151
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