Patent Assignment Details
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| Reel/Frame: | 045251/0319 | |
| Pages: | 3 |
| | Recorded: | 03/16/2018 | | |
| Attorney Dkt #: | 763P057 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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15923024
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Filing Dt:
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03/16/2018
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Publication #:
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Pub Dt:
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10/04/2018
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Title:
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Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
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Assignee
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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NIELDS, LEMACK & FRAME, LLC
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176 E. MAIN STREET
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SUITE #5
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WESTBOROUGH, MA 01581
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04/28/2024 09:47 PM
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