Patent Assignment Details
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| Reel/Frame: | 045277/0864 | |
| Pages: | 4 |
| | Recorded: | 03/19/2018 | | |
| Attorney Dkt #: | 11106/1047 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/05/2019
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Application #:
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15924707
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Filing Dt:
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03/19/2018
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Publication #:
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Pub Dt:
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09/27/2018
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Title:
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LIQUID EJECTING HEAD CHIP, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD CHIP
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Assignee
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| 8, NAKASE 1-CHOME, MIHAMA-KU |
| CHIBA-SHI, CHIBA, JAPAN 261-8507 |
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Correspondence name and address
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TADASHI HORIE/KOH HINOKAWA
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P.O. BOX 10395
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CHICAGO, IL 60610
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