Patent Assignment Details
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| Reel/Frame: | 045369/0127 | |
| Pages: | 3 |
| | Recorded: | 03/28/2018 | | |
| Attorney Dkt #: | 763P059 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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15936600
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Filing Dt:
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03/27/2018
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Publication #:
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Pub Dt:
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10/04/2018
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Title:
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Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
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Assignee
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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NIELDS LEMACK & FRAME LLC
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176 E. MAIN STREET
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SUITE 5
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WESTBOROUGH, MA 01581
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04/29/2024 12:41 AM
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