Patent Assignment Details
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| Reel/Frame: | 045400/0505 | |
| Pages: | 4 |
| | Recorded: | 03/30/2018 | | |
| Attorney Dkt #: | MIN.228 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15765184
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Filing Dt:
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03/30/2018
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Publication #:
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Pub Dt:
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08/23/2018
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Title:
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FLIP-CHIP PACKAGE WITH PROTECTIVE LAYER FOR ELECTROMAGNETIC NOISE REDUCTION
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Assignee
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 1730001 |
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Correspondence name and address
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JEFF LLOYD
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PO BOX 142950
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GAINESVILLE, FL 32614-2950
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