Patent Assignment Details
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| Reel/Frame: | 045416/0684 | |
| Pages: | 6 |
| | Recorded: | 02/22/2018 | | |
| Attorney Dkt #: | 16548/1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED ON REEL 038035 FRAME 0461. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/24/2018
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Application #:
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15023254
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Filing Dt:
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03/18/2016
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Publication #:
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Pub Dt:
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08/11/2016
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Title:
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METHOD FOR EVALUATING INTERNAL STRESS OF SILICON CARBIDE MONOCRYSTALLINE WAFER AND METHOD FOR PREDICTING WARPAGE IN SILICONE CARBIDE MONOCRYSTALLINE WAFER
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Assignee
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| 7-16-3, GINZA, CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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Correspondence name and address
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ANDREWS KURTH KENYON LLP
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ONE BROADWAY
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NEW YORK, NY 10004
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